Company History

1989 Company establishment.
Manufacturing trimming and forming dies for semiconductor industry.
1991 Expansion of plant facilities and mechanical equipment.
Standard manufacturing tools for semiconductor sealing.
1993Expansion of plant facilities and mechanical equipment.
1995Integrated production from design to assembly trimming and forming dies for semiconductor industry.
1996 Expansion of the plant.
Integrated production from design to assembly dies for semiconductor sealing.
1998 Completion of new plant.
Expansion of E.D.M. and MC.
2004Shift to high precision plates as main product.
2008Expansion of W.E.D.M.
2009Expansion of Grinding Machine and MC.
2010Expansion of W.E.D.M.
2012Expansion of W.E.D.M.
2014Expansion of Grinding Machine.
2016Expansion of the plant.

The main features of High-Precision plate

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