History
1989 | Company founded |
1991 | Started manufacturing semiconductor T/F molds |
Expansion of factory equipment and mechanical equipment | |
Started manufacturing semiconductor encapsulation molds | |
1993 | Expansion of factory and machinery equipment |
1995 | Started designing and manufacturing semiconductor T/F molds. |
1996 | Factory expansion |
Started designing and manufacturing semiconductor encapsulation molds | |
1998 | New factory completed |
Discharge/MC expansion | |
2003 | Started business focusing on high-precision plates |
2007 | Wire electrical discharge machine added |
2009 | Grinding machine, MC addition |
2010 | Wire electrical discharge machine added |
2012 | Wire electrical discharge machine added |
2014 | Added grinding machine |
2016 | Factory expansion |